US plastics giant Bemis has linked up with a printed electronics company to develop intelligent packaging which it claims will be commercially available in two years time printed electronics technology in the form of sensor labels that can collect and wirelessly communicate sensor information such as humidity, temperature and environmental factors affecting packaging from manufacture to commercial scale. In a statement, Bemis said that the agreement will accelerate the commercial development of functional sensor labels manufactured from new and emerging printed electronic technology made from Thin Film’s proprietary read/writable printed memory and program logic.When used with Bemis packaging, the line of intelligent labels will monitor and record and key physical properties and environmental data in packaged perishable products. “Intelligent packaging is an emerging technology with many potential intersections with Bemis’ flexible packaging and pressure sensitive materials business segments,” said Henry Theisen, Bemis Company president and chief executive. Theisen added: “Our agreement with Thin Film Electronics ASA is an investment in technology that could eventually make printed electronics a component of every package we manufacture.” The Bemis Intelligent Packaging Platform is expected to be commercially available in 2014.
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